Ultra High Frequency Receiving Module and Chip Set for Radio-Location Systems with Digital Phased Antenna Arrays, and Other SoC Radio Engineering Systems

Description

This ultra high frequency single-chip receiving module is designed for radio location systems with multi-channel digital phased antenna arrays and for other radio engineering systems. The module is a receive path with the following nodes: circuit-controlled digital attenuator system, buffer amplifier for system loss adjustment, intermediate frequency mixer and amplifier. The signal is phase-processed in the digital unit of the receiving module. Multi-channel receivers also use local oscillator amplifiers to reduce the total power of the external oscillator and isolate channels.

Equipped with broadband functional nodes, the receiving module has a wide range of application and can be used in radio-frequency (RF) paths in L-, S-, С-receivers and in intermediate frequency (IF) paths in X-, Ku- и Ka-receivers. The RF and IF bandwidth is achieved with the help of appropriate external filters. This principle makes it easier, faster and cheaper to develop and engineer receiving devices for any purposes.

The module is designed as a single-chip IC (system on a chip) based on the silicon-germanium technology. The ICs (both packaged and not) can also be engineered as individual functional nodes.

As of today, a single-chip transmitting module is under development.

The development was completed for LEMZ-T.

Specifications

• RF range: 1-4.5 GHz (for individual functional nodes: 0.1 GHz to 6.8 GHz).
• IF range: 50-500 MHz.
• Noise ratio: 8..9 dB.
• Transmission ratio (TR): 20 dB.
• Amount of gain control: 30 dB.
• Gain control step: 1 dB.
• Digital control interface: SPI and/or parallel interface.
• Logical levels: +3.3/5 V.
• Power supply voltage: +5 V.
• Chip size: 4*4 mm2.

Advantages

Hybrid ICs and GaAs monolithic ICs do not satisfy the modern requirements for microwave radio-electronic devices, especially in manufacture of small multi-purpose radio-engineering systems.

An SoC receiving module based on the silicon-germanium technology makes it possible to achieve a wider functionality, superior specifications, smaller size and weight, and a higher performance and reliability of radio-electronic systems.

Application

• AESA and DFA radars
• Mobile and private communications, electronic systems for small aircraft and robotics
• Mini and micro transmitting and receiving modules
• Installation in mobile objects and clothes (small aircraft controls, smart clothes, intelligent military garment, etc.) and implantation in biological objects.